OSI Subfloor Construction Adhesive, Series: SF-450, 28 oz Capacity, Cartridge, 50 g/l VOC, 200000 cP Viscosity, 7 - 9 pH, Paste, Tan, 86 ft at 1/4 in Bead, 38 ft at 3/8 in Bead Coverage, 60 Min Application, 2 - 7 Days Functional Cure, Acrylic Odor/Scent, 104 Deg F Flash Point, Media: Carbon Dioxide, Foam, Powder and Water Fog, Composition: Limestone, Acetone, Kaolin, Urea, Ethanol, Quartz (SiO2), 1.335 Specific Gravity, 20 - 120 Deg F Application, Application Method: Utility Knife and Caulking Gun, Latex Base, 100 - 228 psi Shear, -20 To 150 Deg F, Resists: Weather, Water and Moisture, Standards: AFG-01, ASTM D3498, For Glued Floor Projects and Deck Constructions
Can be used in most interior and exterior construction projects either on the job or the production line. It bonds all wood to wood assemblies dry, wet or frozen. Primarily designed for on-site bonding of subfloor and plywood decking to joists during cold weather. Suitable for subfloor, glued floor systems, tongue-and-groove flooring, standard wood construction, concrete, masonry, and wood-to-wood assemblies. Ideal for use in prefab or modular construction. Bridges minor framing gaps. Helps reduce squeaky floors.
Liquid Nails Subfloor and Deck Construction Adhesive, 28 oz Capacity, Cartridge, 18 g/l VOC, 200000 cP Viscosity, Liquid, White, 88 ft Linear at 1/4 in Bead Coverage, 24 hr Drying Time, 15 - 20 Min Application, 2 weeks Functional Cure, Very Mild Latex Odor/Scent, 204.8 Deg F Flash Point, Composition: Limestone, Acrylic (Co) Polymer, Water-Borne Kaolin, Propane-1,2-Diol, Epoxiamina Cicloalifatica, Ethanol, Quartz (SiO2), Vinyl Acetate, Formaldehyde, Water, Flammability Rating: 1, 22 - 120 Deg F Application, Applicable Materials: Plywood and Waferboard, Drywall and Tileboard, Application Method: Gunning, Latex Base, 350 psi at 24 hr, 450 psi at 48 hr, 500 psi at 7 Days Shear, -20 To 140 Deg F, Resists: Water, Standards: ASTM D3498/C557, APA-AFG-01, For Interior and Exterior Applications